[AI07]大模型(CC GPT)
请求参数
此 API 接口支持的参数列表
| 名称 | 类型 | 示例 | 描述 |
|---|---|---|---|
必填 | string | <|start_header_id|>user<|end_header_id|>
Role: You are an expert in the patent field and patent novelty examination, capable of decomposing technical features from input target texts.
Input Content:
<**Target Patent Claims**>: '1. A ceramic substrate structure for an optical device, comprising:
a ceramic substrate having a first surface, a second surface, and a plurality of glue injection holes, wherein the first surface comprises a plurality of cup-shaped molding regions, a plurality of die bonding regions, and a plurality of first metal circuits; the second surface comprises a plurality of second metal circuits; each glue injection hole connects the first surface and the second surface, and has a first opening located at the first surface and a second opening located at the second surface, wherein the first opening is disposed in the cup-shaped molding region;
an insulating layer covering the second surface, wherein the insulating layer exposes the second metal circuits and the second opening; and
a plurality of carrier resin cups combined on the cup-shaped molding regions by injection molding, wherein each carrier resin cup is connected to the first metal circuits and surrounds a die bonding region.
2. The ceramic substrate structure for an optical device according to claim 1, wherein the ceramic substrate further comprises a plurality of metal barrier rings formed on the first surface and respectively located at the periphery of each cup-shaped molding region.
3. The ceramic substrate structure for an optical device according to claim 2, wherein the metal barrier rings are made of electroplated copper.
4. The ceramic substrate structure for an optical device according to claim 1, wherein the insulating layer is made of solder resist.
5. A ceramic substrate structure for an optical device, comprising:
a ceramic substrate having a first surface, a second surface, and a glue injection hole, wherein the first surface comprises a cup-shaped molding region, a die bonding region, and a plurality of first metal circuits; the second surface comprises a plurality of second metal circuits; the glue injection hole connects the first surface and the second surface, and has a first opening located at the first surface and a second opening located at the second surface, wherein the first opening is disposed in the cup-shaped molding region;
an insulating layer covering the second surface, wherein the insulating layer exposes the second metal circuits and the second opening; and
a carrier resin cup combined on the cup-shaped molding region by injection molding, wherein the carrier resin cup is connected to the first metal circuits and surrounds the die bonding region.
6. The ceramic substrate structure for an optical device according to claim 5, wherein the ceramic substrate further comprises a plurality of metal barrier rings formed on the first surface and respectively located at the periphery of each cup-shaped molding region.
7. The ceramic substrate structure for an optical device according to claim 6, wherein the metal barrier rings are made of electroplated copper.
8. The ceramic substrate structure for an optical device according to claim 5, wherein the insulating layer is made of solder resist.
9. A ceramic substrate process for an optical device, comprising:
a) providing a ceramic substrate having a first surface, a second surface, and a glue injection hole connecting the first surface and the second surface;
b) performing laser, sputtering, metal circuit formation, copper electroplating, and film-stripping etching processes on the ceramic substrate;
c) performing a solder resist process on the first surface;
d) performing a solder resist process on the second surface; and
e) performing an injection molding process on the ceramic substrate to form a plastic carrier cup on the first surface.
10. The ceramic substrate process for an optical device according to claim 9, wherein the first surface comprises a cup-shaped molding region, a die bonding region, and a plurality of first metal circuits, and the copper electroplating process in step b) comprises forming a plurality of metal barrier rings at the periphery of the cup-shaped molding region.
11. The ceramic substrate process for an optical device according to claim 9, wherein the glue injection hole has a first opening located at the first surface and a second opening located at the second surface, the second surface comprises a plurality of second metal circuits, and the solder resist process in step d) exposes the metal circuits and the second opening.
'
Task Description:
Task 1: Analyze the claims of the target patent and decompose the technical features.
1. Decomposition Logic:
a. Decompose the technical features of each claim one by one.
b. If multiple contents in the technical solution are closely related and interdependent, jointly solving the same technical problem and producing independent technical effects through synergistic action, these contents should be decomposed as one technical feature.
c. Technical features may include: product components, connection relationships between components, method steps, relationships between steps, composition and proportions and their interactions, etc. Technical features can be constituent elements of the technical solution of a claim, or the interrelationships between elements.
d. Technical features typically include descriptions of performance/parameters/uses/functions/preparation methods/effects/logic/synergistic relationships of components and structures. Such descriptions should be integrated with the component/structure as a whole feature and must not be split into multiple features, e.g., "as the pressure cap screws into the clamp, the clamp's jaws contract and grip the outer surface of the casing, thereby achieving the connection between the sacrificial anode and the casing," or "fixed center frame (1), used to support items to be mechanically processed."
e. Patent claims use open-ended/closed-ended language, such as: comprising, consisting of, mainly consisting of, composed of, etc. These expressions have actual significance for the scope of protection of the claims and must not be omitted.
f. Strictly ensure that the subject name of each claim is listed as an independent technical feature, e.g., a device/method for xx. The subject name of dependent claims typically uses "the claim X" or similar language.
2. Decomposition Restrictions:
a. Strictly ensure all content of the target patent claims is decomposed without omission. The technical features of the target patent must strictly follow the description in the claims; the sum of technical features constitutes the claim. The scope of protection of a claim is defined by all the content recorded in the claim as a whole.
b. Clearly identify the relationships between technical features in each claim. The decomposition of technical features must follow the original description and must not add numbering or expressions unrelated to the original content, nor arbitrarily rewrite it.
c. Ignore "wherein" or similar expressions in the claims.
d. Pay careful attention to hierarchical relationships. Content before a colon must be retained, such as [the following preparation process:] or [the said xx device comprises:] or [comprising the following proportions:] or [raw material composition:] or [comprising the steps of:] and similar expressions, which must be listed as a separate cell.
e. Parentheses and their content following technical features in the claims must be retained; pronouns such as [said xx], [the xx], [its xx] before nouns must not be omitted.
f. If the original claim has a clear structure, such as through line breaks or semicolons, the original structure should be followed as closely as possible.
Task 2: Generate the technical feature decomposition.
1. Output only the results of the technical feature decomposition.
2. Each claim should be decomposed independently under a separate key.
3. The language should be consistent with the target claims (e.g., if the target claims are in English, the technical feature decomposition column should also be in English).
Notes:
1. Only output the technical feature decomposition results of Task 2;
2. Output in Markdown format, containing two columns: ID and claim_feature. Multiple claims are distinguished by their numbers, e.g.: ###claim_1 ###claim_2
Example:
###claim_1
| ID | claim_feature |
|------|------|
| 1 | xx |
| 2 | xx |
| 3 | xx |
| 4 | xx |
| 5 | xx |
| 6 | xx |
<|eot_id|><|start_header_id|>assistant<|end_header_id|> | 用户问题
注意：不超过500个字符。 |
| boolean | true | 当接口返回结果时，是否需要流式返回结果：
true：代表需要
false：代表不需要
注：默认值为true。 |
响应结构
API 响应数据的结构说明
| 字段名 | 类型 | 示例 | 描述 |
|---|---|---|---|
data | object | - | 响应数据 |
output | object | Please check the form: OutputInfo | 调用结果信息，对于专利大模型，包含会话结果text |
usage | object | Please check the form: AiPatGptUsage | 计量信息，表示本次请求所消耗的计量数据 |
input_tokens | integer<int32> | 23 | 用户问题经过Token化后的长度 |
total_tokens | integer<int32> | 320 | 模型调用完成后消耗的总Token长度 |
output_tokens | integer<int32> | 297 | 模型生成文本经过Token化后的长度 |
status | string | finished | 会话状态
注意：
当status = “running” 时，系统正在SSE输出；
当status = “finished” 时，请求结束；
当status= “length”时，生成长度过长导致超过模型最大长度 |
content | string | 根据公开号为CN109213437A的 | 会话结果 |
status必填 | boolean | false | 状态 |
error_msg | string | The request parameter format is incorrect！ | 错误信息 |
error_code必填 | integer | 0 | 错误代码 |
成功响应示例
成功调用 API 的响应示例
JSON
{
"data": {
"output": {
"usage": {
"input_tokens": 23,
"total_tokens": 320,
"output_tokens": 297
},
"status": "finished",
"content": "根据公开号为CN109213437A的"
}
},
"status": true,
"error_code": 0
}错误码
此接口可能返回的错误码列表
业务错误码
| 错误码 | 描述 |
|---|---|
68300004 | 请求参数异常! |
68300005 | 查询Api失败! |
68300006 | 解析基本存取错误! |
68300007 | 存在错误的请求! |
68300008 | 服务中断异常，请稍后再试! |
68300010 | 文件不符合上传规范! |
平台错误码
| 错误码 | 描述 |
|---|---|
67200000 | API整体限流错误! |
67200001 | API整体限流错误！ |
67200002 | 当前调用速率过快,超过当前配置限制QPS！ |
67200003 | 申请token的key和secret传参不正确或者客户端已被禁用！ |
67200004 | 请求的接口无权限请联系我们的支持人员！ |
67200005 | 账户余额/调用次数不足！ |
67200006 | 客户端超过开通有效期！ |
67200007 | 当前调用超过当天配置使用额度！ |
67200008 | 请检查query参数中必填的apikey是否传输！ |
67200009 | apikey与所传的bearerToken不匹配,请检查是否使用在有效期内的token！ |
67200012 | 请求不合法！ |
67200100 | 当前服务器状态正忙,请求响应超时！ |
67200101 | 当前请求的Api不存在请检查请求Path！ |
HTTP 状态码
| 状态码 | 描述 |
|---|---|
0 | 请求成功 |
33610400 | 用户输入错误内容不合法 |
33610500 | 模型返回结果涉及部分内容不合法 |
33610600 | 系统内部异常 |
性能指标
此接口的预期性能特征
正常响应时间
5000 ms
最大响应时间
10000 ms